Manufacturing Technology

At RAYTRON, Manufacturing Technology means a fully engineered chain from raw metal to finished coil, combining cladding, rolling, annealing, slitting and surface treatment to deliver highly consistent conductors for demanding applications.

We are a technology‑driven mill focused on bimetal cladding and ultra‑precision rolling, so customers get tailored conductor structures and extreme dimensional accuracy rather than just generic copper or aluminum strip.

The typical route includes raw material selection, surface cleaning, cladding or bonding, multi‑stage rolling, annealing, edge finishing, slitting, surface treatment and final inspection before packing.

Each critical step has defined process windows, on‑line monitoring and sampling plans, supported by trained operators and SPC tools to keep every batch inside narrow tolerance bands.

Because the heart of our value is turning basic metals into high‑performance, application‑ready conductors that help customers reduce weight, cost and risk in their own products.

After development, we lock down process parameters, qualify equipment and operators, and use continuous feedback from QC data to keep long‑term production stable.

Yes, our lines are designed with flexible setups and precise controls so material changes are carefully managed and do not compromise dimensional or performance consistency.

New technologies are validated through lab trials and pilot runs before being transferred to mass‑production lines with clear control plans and operator training.

Automation ensures stable tension, speed and positioning, reducing human variation and making every coil more consistent and predictable for our customers’ processes.

We focus our most advanced technologies where they create the biggest customer benefit, combining high precision with lean production and strong material utilization.

We metallurgically bond a copper layer to an aluminum core under controlled pressure and temperature, then reduce the composite through rolling and drawing into the final conductor size.

Unlike plating, our cladding process creates a thick, uniform copper layer that is metallurgically bonded, giving far better peel resistance and long‑term stability.

Metallurgical bonding ensures the copper and aluminum layers behave as one piece during bending, drawing and service, minimizing risks of cracking or delamination.

Copper layer thickness is defined in the design and tightly controlled by starting tube dimensions, cladding geometry and subsequent rolling reductions.

Yes, by adjusting the starting copper‑to‑aluminum geometry and the rolling schedule, we can flexibly produce CCA with different copper volume percentages.

Our process and tooling are designed so that reductions are applied uniformly around the circumference, preserving copper continuity even after significant size reduction.

Weak bonding can lead to peeling, cracking or unstable resistance, so we design and test our cladding to exceed required bond‑strength levels.

We use a combination of mechanical tests such as peel, torsion and bending, plus cross‑section analysis, to verify that bond quality meets our internal criteria.

Yes, by optimizing copper thickness and uniformity, we can tailor the surface layer to maximize high‑frequency performance for telecom and RF applications.

Strict surface preparation, cleanliness control and carefully controlled bonding conditions help ensure a clean interface with minimal voids or inclusions.